E-Fill materials are ideally suited for use in electronic devices. Our proprietary hydro-metallurgical process ensures a continuous, uniform coating resulting in a highly conductive filler material. These materials are available as metal-coated metallic or non-metallic core particles.
Superior properties of E-Fill products
- Electromagnetic Interference (EMI) shielding
- Radio Frequency Interference (RFI) shielding
- Conductivity
- Heat transfer
Typical applications
- Coatings Inks
- Adhesives
- Tapes
- EMI gaskets
- Elastomers
- Sealants
Trust our experience
Consult with us on the ideal conductive filler material for your application. We understand how to optimize cost and performance through selecting ideal powder characteristics, such as:
- Particle shape
- Size distribution
- Morphology
- Cladding thickness